MyWave is a development project for the integration of electronic circuits inside a plastic component. While the control possibility by means of capacitive fields through comparatively thick layers of plastic and printed IML foil is tested on a flat surface (cp Innovation No. 23) during the first stage, the new 3D-MyWave goes one step further. With a corrugation in the component lid and contoured conductors it illustrates the spatial flexibility of the future-oriented technology.